Optimal Thermo-Structural Analysis for High Density Package Mounting on Build-up Board
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: IEEJ Transactions on Sensors and Micromachines
سال: 2003
ISSN: 1341-8939,1347-5525
DOI: 10.1541/ieejsmas.123.504